大数据存储计算

BIG DATA STORAGE AND COMPUTING

As the development of semiconductor process nodes to 7nm and below slows down, the integrated circuit industry is gradually entering the post-Moore era. In the field of high-performance computing, technological innovation has increasingly strong requirements for high-efficiency and energy-saving chips, and various advanced packaging technologies have also received more and more attention. At present, system-in-package SiP has become the mainstream packaging solution in the field of high-performance computing. Among them, chiplet technology and 2.5D/3D packaging have rapidly emerged and become a technology trend for high-performance computing applications.